COPPER SULFATE PLATING BATH AND ELECTROLYTIC COPPER PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a copper sulfate plating bath and an electrolytic copper plating method which are effectively applied particularly to a copper damascene method and to a case where plating is simultaneously performed to a through hole and a blind via hole.;SOLUTION: The copper sulfate plating bath is obtained by using copper sulfate and sulfuric acid as the main ingredients and adding a copolymer of an acrylic acid quaternized compound and/or a methacrylic acid quaternized compound and styrene thereto. The copper sulfate plating bath can suitably be utilized to a copper damascene method where a plating film is filled into fine grooves and connecting holes applied for interlayer connection. Further, via filling and through hole plating can simultaneously be performed.;COPYRIGHT: (C)2004,JPO