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Recognition manner of the minute work piece and the pickup null which uses

机译:微小工件的识别方式及所使用的拾零

摘要

Based on the result of image recognition of the first wafer, the scan area of image recognition in the second and later wafers is determined. For example, in an appearance inspection process of semiconductor pellets, the first wafer is scanned over for image recognition to determine a contour (hereinafter referred to as the polygon) of a set constituted by pellets excluding non-shaped pellets as the scan area for the second and later wafers. This allows for reducing the scan area for the second and later wafers, thereby eliminating unnecessary areas to scan and saving time and costs required for the work.
机译:基于第一晶片的图像识别结果,确定第二晶片和随后的晶片中的图像识别的扫描区域。例如,在半导体粒料的外观检查过程中,对第一晶片进行扫描以进行图像识别,以确定由除非定形粒料以外的粒料构成的组的轮廓(以下称为多边形)作为扫描区域。第二和以后的晶圆。这允许减小第二晶片及后续晶片的扫描面积,从而消除了不必要的扫描面积并节省了工作所需的时间和成本。

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