首页> 外国专利> LASER PROCESSING METHOD, LASER WORKED PRODUCTION METHOD, LASER PROCESSING APPARATUS, AND COMPUTER-READABLE RECORDING MEDIUM CONTAINING A PROGRAM FOR CAUSING COMPUTER TO EXECUTE LASER PROCESSING OR LASER WORKED PRODUCTION METHOD

LASER PROCESSING METHOD, LASER WORKED PRODUCTION METHOD, LASER PROCESSING APPARATUS, AND COMPUTER-READABLE RECORDING MEDIUM CONTAINING A PROGRAM FOR CAUSING COMPUTER TO EXECUTE LASER PROCESSING OR LASER WORKED PRODUCTION METHOD

机译:激光加工方法,激光加工生产方法,激光加工设备以及包含程序的计算机可读记录介质,该程序用于使计算机执行激光加工或激光加工生产方法

摘要

PROBLEM TO BE SOLVED: To reduce the amount of removal of a covering material at a difficult-to- expand or- separate portion of sufficiently leave the covering material at the machined edge, and prevent the protection of the material surface from decreasing by changing the machining conditions of the first machining process and changing the removal range on the final machining locus. SOLUTION: At a hole-making start portion 23, a circular resin sheet removal portion 25 is obtained by radiating a laser beam 1 to a work under the conditions extracted from a machining program recorded in a memory. In the second machining process, the laser beam machining is started from the hole making start portion 23 by radiating the laser beam 1 to the hole-making start portion 23 of the work under the cutting condition of a steel 21. During the laser beam machining, the steel 21 is cut as the laser beam 1 moves. In addition, a resin sheet 26 around the cut portion of the steel 21 is removed by the laser beam 1. The width of this removed resin sheet 22 is smaller than the diameter of the resin sheet removal portion 25. Much of the assist gas blown out to the machined portion flows into a cut groove 24.
机译:要解决的问题:为了减少覆盖层材料在难以扩展或分离的部分的去除量,将覆盖层材料留在机加工边缘,并通过改变覆盖率来防止保护材料表面第一次加工过程的加工条件,并更改最终加工轨迹的去除范围。解决方案:在打孔开始部分23处,通过从存储在存储器中的加工程序中提取的条件下向工件辐射激光束1,获得圆形树脂片去除部分25。在第二加工工序中,在钢21的切削条件下,通过将激光束1照射到工件的制孔开始部23,从而从制孔开始部23开始激光加工。因此,随着激光1的移动,钢21被切断。另外,通过激光束1去除钢21的切割部分周围的树脂板26。该去除的树脂板22的宽度小于树脂板去除部25的直径。流出到机加工部分流入切槽24。

著录项

  • 公开/公告号JP3512634B2

    专利类型

  • 公开/公告日2004-03-31

    原文格式PDF

  • 申请/专利权人 三菱電機株式会社;

    申请/专利号JP19980127628

  • 发明设计人 村井 融;

    申请日1998-05-11

  • 分类号B23K26/00;B23K26/14;

  • 国家 JP

  • 入库时间 2022-08-21 23:23:44

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号