Semiconductor fabrication apparatus, pod carry apparatus, pod carry method, and semiconductor device production method

摘要

In a semiconductor fabrication apparatus, a pod that receives a single substrate using a substrate supporting table and a lid member in a sealing state is loaded from outside of a chamber and the pod is opened within the chamber so as to enable the substrate received in the pod to be held and managed. The semiconductor fabrication apparatus includes a first pod conveyance device that transfers the pod from a pod loading position to a pod opening position, a pod opening device that causes the lid member of the pod transferred by said first pod conveyance device to be left outside the chamber and causes the supporting table to be separated into the chamber from the pod. A substrate storage rack provided within the chamber stores a plurality of substrates, and a substrate carrying device provided within the chamber takes out the substrate on the substrate supporting table and puts the substrate into the substrate storage rack.