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Method for stack-packaging integrated circuit die using at least one die in the package as a spacer
Method for stack-packaging integrated circuit die using at least one die in the package as a spacer
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机译:使用封装中的至少一个裸片作为间隔物来堆叠封装集成电路裸片的方法
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摘要
A method for producing a semiconductor package without spacer components has steps of (a) providing at least two rectangular die components each having a length greater than a width and bond pads implemented on the short sides only; (b) cross stacking the die components on a substrate for package assembly such that the bond-pad arrays are unobstructed; (c) wire bonding the unobstructed bond pads on each die component to the substrate; and (d) encapsulating the package.
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