METHOD OF FORMING POLYIMIDE COATING CONTAINING DIELECTRIC FILLER ON SURFACE OF METALLIC MATERIAL, PROCESS FOR PRODUCING COPPER CLAD LAMINATE FOR FORMATION OF CAPACITOR LAYER FOR PRINTED WIRING BOARD AND COPPER CLAD LAMINATE OBTAINED BY THE PROCESS

摘要

A method of forming a dielectric layer containing dielectric filler, which is excellent in film thickness uniformity, from a polyimide electrodeposition liquid containing dielectric filler. In particular, a method of forming a polyimide coating containing dielectric filler on a surface of metallic material according to the electrodeposition coating technique, characterized in that as the dielectric filler, use is made of dielectric powder of perovskite structure in approximately spherical form which has an average particle diameter (D1A) of 0.05 to 1.0 μm and a weight cumulative particle diameter (D50), measured in accordance with the laser diffraction scattering type particle size distribution measuring method, of 0.1 to 2.0 μm and further exhibits an aggregation degree, in terms of D50/D1A wherein D50 and D1A represent a weight cumulative particle diameter and an average particle diameter obtained by image analysis, respectively, of 4.5 or less.