Method of minimizing thermal stress in reversible wafer bonding technique of compound semiconductor wafer

摘要

PURPOSE: A method for minimizing thermal stress in a reversible wafer bonding technique of a compound semiconductor is provided to prevent the damage of the compound wafer due to the thermal stress generated from a bonding process by detecting an optimum condition. CONSTITUTION: A plurality of optimum process temperature values are obtained by inputting each size and each material property of the first and the second wafer(3,1) and a bonding material(2) into a thermal stress formula. The first wafer(3) is heated under the optimum temperature. The bonding material(2) is coated on the second wafer(1). The second wafer(1) is aligned on the first wafer(3). The second wafer(1) is bonded on the first wafer(3) by heating the second wafer(1) under the optimum temperature during a constant period of time.