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Ag ALLOY THIN FILM FOR USE AS REFLECTIVE FILM OF FPD (FLAT PANEL DISPLAY) IN LCD, SPUTTERING TARGET, AND METHOD FOR PRODUCING Ag ALLOY THIN FILM
Ag ALLOY THIN FILM FOR USE AS REFLECTIVE FILM OF FPD (FLAT PANEL DISPLAY) IN LCD, SPUTTERING TARGET, AND METHOD FOR PRODUCING Ag ALLOY THIN FILM
PURPOSE: To provide an Ag-alloy thin film having high reflectance and superior adhesiveness to a substrate and superior corrosion resistance as well, and to provide a sputtering target and a method for producing the Ag-alloy thin film. CONSTITUTION: The Ag alloy thin film comprises Ag as a main component, 0.1 to 4.0 atom.% of Au and 0.1 to 2.5 atom.% of Sn, wherein the Ag alloy thin film further comprises 0.1 to 3.0 atom.% of oxygen. The sputtering target comprises Ag as a main component, 0.1 to 4.0 atom.% of Au and 0.1 to 2.5 atom.% of Sn, wherein the sputtering target further comprises 0.1 to 3.0 atom.% of oxygen. The method for producing the Ag-alloy thin film comprises the steps of employing an Ag alloy sputtering target, supplying an Ar gas as a sputtering gas and at least one or more of oxygen contained gases selected from O2, H2O and H2+O2 as an additive gas, and sputtering the target to manufacture the Ag alloy film containing Ag as a main component, 0.1 to 4.0 atom.% of Au and 0.1 to 2.5 atom.% of Sn and additionally containing 0.1 to 3.0 atom.% of oxygen, wherein the oxygen contained gases are supplied only during the initial stage of film forming by the sputter, and wherein a primer layer is formed by depositing the Ag alloy thin film on a metal oxide film in such a way that the Ag alloy thin film is produced by sputtering the sputtering target with or without supplying of the additive gas.
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机译:用途:提供具有高反射率和对基材的优异粘合性以及优异的耐腐蚀性的银合金薄膜,并且提供溅射靶和银合金薄膜的生产方法。组成:该Ag合金薄膜包含Ag作为主要成分,0.1至4.0原子%的Au和0.1至2.5原子%的Sn,其中该Ag合金薄膜还包含0.1至3.0原子%的氧。溅射靶包括Ag作为主要成分,0.1至4.0原子%的Au和0.1至2.5原子%的Sn,其中溅射靶还包含0.1至3.0原子%的氧。所述Ag合金薄膜的制造方法包括以下步骤:采用Ag合金溅射靶,提供Ar气作为溅射气体,以及从O 2,H 2 O和H 2 + O 2中选择的至少一种或多种含氧气体作为气体。用添加剂气体溅射靶材,以制造以Ag为主要成分,Au为0.1〜4.0原子%,Sn为0.1〜2.5原子%,氧为0.1〜3.0原子%的Ag合金膜,其中含氧气体仅在通过溅射成膜的初始阶段提供,并且其中通过以如下方式制备Ag合金薄膜的方式在金属氧化物膜上沉积Ag合金薄膜来形成底漆层:在添加或不添加添加气体的情况下溅射溅射靶。
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