首页> 外国专利> WAFER CARRIER TO IMPROVE PRODUCTIVITY BY INSTALLING WAFER MAPPING SENSOR AND WAFER ALIGNING SENSOR SIMULTANEOUSLY

WAFER CARRIER TO IMPROVE PRODUCTIVITY BY INSTALLING WAFER MAPPING SENSOR AND WAFER ALIGNING SENSOR SIMULTANEOUSLY

机译:晶圆载体通过同时安装晶圆映射传感器和晶圆切片传感器来提高生产率

摘要

Purpose: a wafer-supporting platform is arranged to increase productivity in the assembly line of an automation, by one chip figure placement sensor of identical installation and a wafer alignment sensor. Construction: a wafer-supporting platform (50) is for carrying and storing wafer. Wafer-supporting platform includes multiple pocket slots, chip figure placement sensor and wafer alignment sensor. A large amount of pocket slots (52) are for holding chip. Chip figure placement sensor (56) is installed in each pocket slot to identify wether, and chip exists, or not. Wafer alignment sensor includes an optical receiving sensor (54h) and a luminescence sensor (54l).
机译:目的:通过一个相同安装的芯片图形放置传感器和一个晶圆对准传感器,安排一个晶圆支撑平台来提高自动化装配线的生产率。结构:晶片支撑平台(50)用于运送和存储晶片。晶圆支撑平台包括多个插槽,芯片图形放置传感器和晶圆对准传感器。大量的凹槽(52)用于容纳切屑。芯片图形放置传感器(56)安装在每个插槽中,以识别是否存在芯片。晶片对准传感器包括光接收传感器(54h)和发光传感器(54l)。

著录项

  • 公开/公告号KR20040088923A

    专利类型

  • 公开/公告日2004-10-20

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR20030023368

  • 发明设计人 KIM BONG SEON;

    申请日2003-04-14

  • 分类号H01L21/68;

  • 国家 KR

  • 入库时间 2022-08-21 22:47:50

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