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Process for depositing nanotubes on planar surfaces used in the semiconductor industry comprises applying a stamp on a substrate to form a microfluidic capillary system, contacting a dispersion of nanotubes, drying, and removing the stamp
Process for depositing nanotubes on planar surfaces used in the semiconductor industry comprises applying a stamp on a substrate to form a microfluidic capillary system, contacting a dispersion of nanotubes, drying, and removing the stamp
Process for nanotube deposition on planar surfaces comprises preparing stamp from elastomeric material having relief structure on one stamp surface, applying stamp to substrate so that substrate and stamp form microfluidic capillary system having inlet and outlet and made from one or more capillaries, contacting nanotube dispersion with capillary system inlet so that dispersion spreads in system under capillary force, drying dispersion, and removing stamp. An Independent claim is also included for an electronic component made from a substrate having discrete structures of nanotubes.
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