Arrangement for cooling electric component mounted on circuit board e.g. for electronic unit for power supply of semiconductor lasers, has electric component joined heat-conductively to metal plate

摘要

An arrangement for cooling an electric component mounted on a circuit-board in which heat is extracted over a heat-conducting mat (7). The component (3) is joined heat-conductively to a metal plate (15) and the metal plate is joined via the mat with a heat-sink (8).