首页> 外国专利> Solder preforms, e.g. solder balls used in micro-electronic applications for assembly of integrated circuits, have a uniform coating of a silane derivative for protection against oxidation

Solder preforms, e.g. solder balls used in micro-electronic applications for assembly of integrated circuits, have a uniform coating of a silane derivative for protection against oxidation

机译:焊片,例如微电子应用中用于集成电路组装的焊球具有均匀的硅烷衍生物涂层,可防止氧化

摘要

Solder preforms, particularly solder balls, are surface-coated with a uniform coating of a coupling agent comprising a silane derivative for protection against abrasion, and to limit the formation of an oxide layer. The coupling agent is a silane derivative of formula Si(R1)(R2)(R3)(R4). R1, R2, R3 and R4 = radicals. An Independent claim is also included for the method of production of the preforms.
机译:焊剂预成型件,特别是焊球,在表面上均匀涂有偶联剂,该偶联剂包含硅烷衍生物,可防止磨损并限制氧化层的形成。偶联剂是式Si(R1)(R2)(R3)(R4)的硅烷衍生物。 R1,R2,R3和R4 =自由基。预制件的生产方法也包括独立权利要求。

著录项

  • 公开/公告号FR2845024A1

    专利类型

  • 公开/公告日2004-04-02

    原文格式PDF

  • 申请/专利权人 INDUSTRIE DES POUDRES SPHERIQUES;

    申请/专利号FR20020012130

  • 发明设计人 BECUE FRANK;CHALEAT BERNARD;

    申请日2002-10-01

  • 分类号B23K35/365;B23K35/22;

  • 国家 FR

  • 入库时间 2022-08-21 22:39:25

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