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Leadframes

机译:引线框

摘要

A lead frame for use in the manufacture of electronic components of the Quad Flat Pack - No Lead Package (QFN) type comprises an array of sites 11 for receiving respective electronic component devices, a plurality of rails 12 arranged in a grid with each site 11 being disposed in respective spaces formed within the grid. Each rail 12 within the grid carries oppositely-directed lead fingers 14 for respective adjacent sites. A further rail extends around the periphery of the array 15 and carries inwardly directed lead fingers 14 for the peripheral sites 11 as well as outwardly directed dummy lead fingers 16. The symmetrical shape and configuration of the terminals 14 and dummy terminals 16 on the peripheral rails 15 is identical to the shape and configuration of the terminals 14 on parallel rails 12 within the array and thus any wire-bonding problems associated with a difference between the resilience and thermal/electrical characteristics of the supporting structure of terminals along the outer side edges of the outer sites of the array and those of the terminals along respective edges of sites within the array are avoided.
机译:用于制造四方扁平包装-无铅封装(QFN)类型的电子组件的引线框架包括用于容纳各个电子组件设备的站点11的阵列,多个导轨12排列成网格,每个站点11布置在形成在网格内的各个空间中。栅格内的每个轨道12都带有用于各个相邻位置的相反方向的导指14。另一轨道围绕阵列15的外围延伸,并携带用于外围位置11的向内指向的导指14以及向外指向的虚拟引线指16。外围导轨上的端子14和虚拟端子16的对称形状和配置。图15中的端子与阵列中的平行导轨12上的端子14的形状和构造相同,因此与沿端子的外侧边缘的端子的支撑结构的弹性和热/电特性之间的差异相关的任何引线接合问题避免了阵列的外部位置和沿着阵列内位置的相应边缘的终端的外部位置。

著录项

  • 公开/公告号GB2392777A

    专利类型

  • 公开/公告日2004-03-10

    原文格式PDF

  • 申请/专利权人 * ATLANTIC TECHNOLOGY;

    申请/专利号GB20020020516

  • 发明设计人 ROBERT RHYS * PROTHEROE;

    申请日2002-09-04

  • 分类号H01L23/495;

  • 国家 GB

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