首页> 外国专利> FIXED FLANGE FOR WAFER CHAMFERING GRINDING STONE, FLANGE REMOVAL TOOL, AND GRINDING STONE MOUNTING METHOD OF WAFER CHAMFERING APPARATUS

FIXED FLANGE FOR WAFER CHAMFERING GRINDING STONE, FLANGE REMOVAL TOOL, AND GRINDING STONE MOUNTING METHOD OF WAFER CHAMFERING APPARATUS

机译:晶圆倒角磨具固定法兰,法兰拆卸工具及晶圆倒角装置的磨具安装方法

摘要

PROBLEM TO BE SOLVED: To provide a fixed flange for a wafer chamfering grinding stone capable of improving working precision by a simple constitution, a flange removal tool, and a grinding stone mounting method of a wafer chamfering apparatus.;SOLUTION: The fixed flange 10 for the wafer chamfering grinding stone is formed with a hole 18 fitted to a motor rotary shaft 40 of a tapered shape so formed as to reduce a diameter toward the tip from its base at its center. The hole 18 has a tapered shape which is roughly the same tapered shape as that of the motor rotary shaft. A shaft 17 wherein the wafer chamfering grinding stone is fitted is formed on the circumference part of the fixed flange for the wafer chamfering grinding stone. A position adjustment means capable of moving the fixed flange for the wafer chamfering grinding stone in the radial direction of the motor rotary shaft is formed between the motor rotary shaft and the fixed flange for the wafer chamfering grinding stone. The relative position of the motor rotary shaft and the fixed flange for the wafer chamfering grinding stone is changed by the position adjustment means, thereby enabling the wafer chamfering grinding stone afferent with respect to the motor rotary shaft.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种用于晶片倒角磨石的固定凸缘,该固定凸缘能够通过简单的构造来提高工作精度,一种凸缘去除工具,以及一种晶片倒角装置的磨石安装方法。解决方案:该固定凸缘10用于晶片倒角的磨石上形成有孔18,该孔18安装到锥形的电动机旋转轴40上,从而形成为从其底部的中心朝向尖端减小直径。孔18具有与电动机旋转轴大致相同的锥形形状。在晶片倒角磨石的固定凸缘的圆周部分上形成有轴17,该晶片倒角磨石安装在该轴17上。在马达旋转轴与晶片倒角用磨石的固定凸缘之间形成有位置调整机构,该位置调整机构能够使晶片倒角用磨石的固定凸缘沿电动机旋转轴的径向移动。位置调节装置改变了用于晶片倒角磨石的电动机转轴和固定法兰的相对位置,从而使晶片倒角磨石相对于电动机转轴传入。;版权:(C)2005,日本特许厅

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