首页> 外国专利> METHOD FOR MANAGEMENT OF IN-FURNACE ATMOSPHERE OF REFLOW SOLDERING EQUIPMENT AND REFLOW SOLDERING EQUIPMENT

METHOD FOR MANAGEMENT OF IN-FURNACE ATMOSPHERE OF REFLOW SOLDERING EQUIPMENT AND REFLOW SOLDERING EQUIPMENT

机译:回流焊设备及回流焊设备炉内气氛的管理方法

摘要

PROBLEM TO BE SOLVED: To provide a method for management of an in-furnace atmosphere by which the oxygen atmosphere in gaseous nitrogen in a furnace of reflow soldering equipment is kept at a desired value and reflow soldering equipment which realizes the method.;SOLUTION: The reflow soldering equipment which performs reflow soldering within the furnace 1 supplied with the gaseous nitrogen is equipped with: gaseous nitrogen supplying means 8 to 23 capable of supplying the gaseous nitrogen into the furnace 1; a means 24 for detecting the oxygen concentration in the furnace 1; and control means 25 and 26 for controlling the oxygen concentration of the gaseous nitrogen supplied from the gaseous nitrogen supplying means 8 to 23 according to the oxygen concentration in the furnace 1 detected by the detecting means 24.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种用于管理炉内气氛的方法,通过该方法可以将回流焊接设备的熔炉中气态氮中的氧气气氛保持在所需值,并实现该方法的回流焊接设备。在供给有气态氮的炉子1内进行回流焊接的回流焊装置具备:能够将气态氮供给到炉子1内的气态氮供给装置8〜23;和能够将气态氮供给到炉子1内的气态氮供给装置。用于检测炉子1中氧气浓度的装置24。控制装置25和26,用于根据由检测装置24检测出的炉1中的氧浓度,控制从气态氮供应装置8至23供应的气态氮的氧气浓度。版权:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2005246476A

    专利类型

  • 公开/公告日2005-09-15

    原文格式PDF

  • 申请/专利权人 YOKOTA TECHNICA:KK;

    申请/专利号JP20040123835

  • 发明设计人 ENDO HIDEO;

    申请日2004-04-20

  • 分类号B23K31/02;B23K1/00;H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-21 22:37:22

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