METAL EVAPORATED FILM AND METAL EVAPORATED MEMBER PROVIDED WITH THE METAL EVAPORATED FILM AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a metal evaporated film with which the problem with the conventional metal evaporated film of difficulty in handling due to an extremely thin film thickness is solved, the film of a large film thickness can be formed and the bonding power to a carrier is high.;SOLUTION: The metal evaporated film is formed of the aggregate of columnar bodies 2 and the shape viewed from the surface is divided to microareas by cracks 2. When the film is effectively utilized as an electrode of electronic components, etc., the bonding to a base material can be intensified and the electrode of the large film thickness can be formed. Also, the transfer along the prescribed shape is possible at the time of transfer.;COPYRIGHT: (C)2005,JPO&NCIPI