The semiconductor equipment which features that lays out

摘要

PURPOSE: To prevent characteristic fluctuation of a semiconductor device due to ion contamination from a semiconductor chip end face, deterioration in electric insulation between devices and inferior function due to LSI maloperation and to detect diffusion of anode ions such as sodium in a bonded oxide film. ;CONSTITUTION: Arrangement position of a semiconductor device 2 is defined to a position capable of preventing malfunction due to ion contamination from an end face 1A of a semiconductor chip 1. Further, a sensor to detect diffusion in a bonded oxide film of anode ions such as sodium between the regions where a semiconductor element arrangement region 2 from the end face 1A of the semiconductor chip 1 is arranged, is disposed.;COPYRIGHT: (C)1995,JPO