METHOD FOR PLACING SUBSTRATE ON PROCESS STAGE, SUBSTRATE EXPOSURE STAGE, AND SUBSTRATE EXPOSURE APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a method for placing a substrate on a process stage suitable for handling a large substrate by which a substrate can be fast placed on a substrate chuck table with high accuracy, and to provide a substrate exposure stage.;SOLUTION: The substrate exposure stage is equipped with: a table having a substrate placing face where a substrate is to be placed; and three or more sucking pins which protrude from the substrate placing face to specified height with respect to the substrate placing face so as to form a plane receiving the substrate and which relatively retreat to at least the substrate placing face. A substrate carried by a handling robot is received and sucked at specified height by the sucking pins, and then placed on the substrate placing face by making the sucking pins relatively retreat to the substrate placing face.;COPYRIGHT: (C)2005,JPO&NCIPI