Inspection data analysis program, defect inspection apparatus, defect inspection system and method for semiconductor device

摘要

Inspection data output from an inspection apparatus is read, the inspection data containing at least one information piece of coordinate value information and size information of a particle or a pattern defect of an inspected object, and drawing data of a product of the inspected object is read. Information is extracted which is representative of a relation between at least one information piece of coordinated value information and size information of the particle or pattern defect of the inspected object in the read inspection data and the read drawing data input at said drawing data input step. The extracted information is compared with determination criterion information registered beforehand and it is determined whether each particle or pattern defect of the inspected object in the inspection data is a detection error or not.