PACKAGING STRUCTURE OF BUS BAR CONSTRUCTION, POWER SUPPLY DEVICE, POWER SUPPLY SYSTEM, ELECTRONIC CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent the deterioration of efficiency of a power supply device due to the deterioration of power supply voltage for a semiconductor, the increase of wasteful power and malfunction or the like due to the lowering of a voltage for a power supplying wiring.;SOLUTION: There is employed a construction wherein a plurality of bus bars are placed in parallel and a width is taken so as to be larger than a distance between parallel sections, while the bus bars are connected to the printed circuit board and the semiconductor element also in this section.;COPYRIGHT: (C)2006,JPO&NCIPI