INTEGRALLY FORMED MICROCHANNEL COOLING DEVICE AND APPARATUS (APPARATUS AND METHOD OF COOLING BY MICROCHANNEL) OF SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and a method of cooling an electronic device such as an IC chip or the like uneven in power density distribution, mounted on a package substrate upside down with efficiency and low operating pressure.;SOLUTION: The invention comprises the apparatus and the method operated by microchannel cooling which locally improve cooling capability with respect to a (hot spot) region of the IC chip higher than an average in power density by operating a mechanism varying local cooling capability with respect to a high power density region (namely, "hot spot") of a semiconductor chip higher than the average in the power density. For example, an integrally formed microchannel cooling device (or a microchannel heat sink device) cooling the IC chip is designed so that the local cooling capability with respect to the high power density region (namely, "hot spot") of the IC chip higher than the average in the power density can vary in such a way that a cooling fluid flows and distributed uniformly, and that a pressure drop along a cooling liquid passage is suppressed to a minimum.;COPYRIGHT: (C)2006,JPO&NCIPI