POLISHING CLOTH, WAFER POLISHING DEVICE, AND METHOD OF MANUFACTURING WAFER

摘要

PPROBLEM TO BE SOLVED: To provide a polishing cloth that can supply a highly flat wafer by suppressing the occurrence of flaws and polishing marks, and to provide a wafer polishing device. PSOLUTION: The height of the surface of the outer periphery of the polishing cloth 12 used for polishing a wafer W is lowered by annularly grinding the outer periphery with a grinding plate 19 on which abrasive diamond grains are electrodeposited. Consequently, the highly flat wafer W which is reduced in plane dripping in the outer periphery can be manufactured, because the polishing resistance is reduced in the outer periphery of the polishing cloth 12. PCOPYRIGHT: (C)2006,JPO&NCIPI