Grinding body for CMP grinding, CMP grinding device, production method of CMP grinding method, and semiconductor device

摘要

Although it uses for the CMP grinding method where it can prevent the fact that the wafer peripheral aspect is ground to excess being the grinding body for ideal CMP grinding, the grinding body for this CMP grinding is formed, the grinding pad, making the hard elastic member and the soft elastic member this order compete, thickness of the aforementioned soft elastic member, is made 1/2 or less of thickness of the aforementioned grinding pad.