A dual-cure silicone composition is provided that is useful to make an encapsulating/potting compound. The dual-cure silicone exhibits both UV- and moisture-initiated curing mechanisms, with the UV-initiated curing mechanism providing very rapid curing compared to conventional dual-cure silicones. The dual-cure silicone is an elastomeric material on curing. In a preferred embodiment, the dual-cure silicone composition is made from a mixture of a first polysiloxane component having terminal mercapto and alkoxy functionality, and a second polysiloxane component having terminal vinyl and alkoxy functionality. Methods of making the first and second polysiloxane components also are disclosed.
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