Quad flat flip chip packaging process and leadframe therefor

摘要

A quad flat flip chip packaging process and a leadframe therefor are provided. A sacrificial film is attached on the leads of the leadframe for limiting the extent of bumps when formed and saving the manufacturing cost. Besides, the sacrificial film can be removed from the leadframe after a reflow step. Thus, the delamination between the molding compound material and the leads can be prevented during the molding step.