首页> 外国专利> Manufacturing electronic component with circuit carrier and electronic component involves positioning circuit carrier on at least one suction device in housing or on carrier section by vacuum, attaching it in housing or to carrier section

Manufacturing electronic component with circuit carrier and electronic component involves positioning circuit carrier on at least one suction device in housing or on carrier section by vacuum, attaching it in housing or to carrier section

机译:具有电路载体和电子元件的电子元件的制造涉及通过真空将电路载体定位在壳体中的至少一个抽吸装置上或在载体部分上,将其附着在壳体中或固定到载体部分上

摘要

The method involves positioning a circuit carrier (40) on at least one suction device arranged in a housing or on a carrier section by vacuum and then attaching it in the housing or to the carrier section. The circuit carrier is in the form of a flexible circuit board or circuit film. An independent claim is also included for an electronic component.
机译:该方法包括通过真空将电路载体(40)放置在布置在壳体中或在载体部分上的至少一个抽吸装置上,然后将其附接到壳体中或附接到载体部分。电路载体为柔性电路板或电路膜的形式。电子元件也包括独立权利要求。

著录项

  • 公开/公告号DE102004048609A1

    专利类型

  • 公开/公告日2006-04-13

    原文格式PDF

  • 申请/专利权人 TYCO ELECTRONICS AMP GMBH;

    申请/专利号DE20041048609

  • 发明设计人 DEMUTH ULRICH;BECK KARL;

    申请日2004-10-06

  • 分类号H05K13/02;B60R16/02;

  • 国家 DE

  • 入库时间 2022-08-21 21:20:42

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