Wiring structures manufacturing method for integrated switching arrangement, involves applying nucleation and insulating layers on planarized surface, and galvanic depositing electro conductive material on open areas of nucleation layer

摘要

The method involves applying an electrically insulating layer (72) on a planarized surface of an integrated switching arrangement after the application of an electro conductive nucleation layer (74) on the surface. The insulating layer is structured so that areas of the nucleation layer are laid open. An electro conductive material is galvanically deposited on the areas laid open.