Resin-Transfer-Molding-device for manufacturing component comprises trough, cover that can be attached to trough, and heating device for manufacturing component by heating starting material that can be enclosed between trough and cover

摘要

A Resin-Transfer-Molding-device has trough (104), into which starting material for manufacturing a component can be introduced; cover that can be attached to the trough in such a way that starting material for manufacturing the component is enclosable between the trough and the cover; and heating device (101) for manufacturing the component by heating starting material that can be enclosed between the trough and the cover. The Resin-Transfer-Molding-device comprises trough, into which starting the material for manufacturing the component can be introduced; cover that can be attached to the trough in such a way that starting material for manufacturing the component is enclosable between the trough and the cover; and heating device for manufacturing the component by heating starting material that can be enclosed between the trough and the cover. The trough is manufactured from a material with a coefficient of expansion that is essentially equal to the coefficient of expansion of starting material for manufacturing the component. Independent claims are also included for: (1) a Resin-Transfer-Molding-arrangement (100) for manufacturing a component, comprising the inventive Resin-Transfer-Molding-device and starting material for manufacturing the component that can be introduced into the trough of the Resin-Transfer-Molding-device or is partially introduced into the trough; and (2) a Resin-Transfer-Molding method for manufacturing the component, comprising introducing starting material for manufacturing the component into a trough; attaching a cover to the trough in such a way that the starting material for manufacturing the component is enclosed between the trough and the cover; and heating the starting material enclosed between the trough and the cover to manufacture the component.