Tape burble manner, the ring frame where it can stick tape burble

摘要

PROBLEM TO BE SOLVED: To reduce peeling man-hour, by permitting a contact part in a size for covering the main part of a tape to which a semiconductor chip is adhered to lower a pusher inclined so that it is brought into contact with the tape with an angle and to peel the tape from a ring frame. ;SOLUTION: A tape to which defective chips 3 are adhered is sealed to a ring frame 1 and the ring frame 1 is set on a peeing table 4. A pusher 5 for peeling off the tape 2 is installed above the tape 2. When the pusher 5 is lowered by the driving devices of an air cylinder and a motor and it is brought into contact with the tape 2, a contact part 51 in a size for covering the main part of the tape 2 is inclined so that it is brought into contact with the tape 2 with the angle. The tape 2 is gradually peeled from an end part. Thus, the tape 2 can automatically be peeled off and peeling man-hour can be reduced.;COPYRIGHT: (C)1999,JPO