Mounting the jig for silicon monocrystal semiconductor wafer heating processing and the device null silicon monocrystal semiconductor wafer for silicon monocrystal semiconductor

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer heating plate-like tool, which can uniformly heat a semiconductor wafer without causing slips or defects even if the semiconductor wafer has a large diameter, and a mounter of the tool. ;SOLUTION: In a plate-like semiconductor wafer heating tool 2, in which a semiconductor wafer 1 is mounted on the upper face to heat it, the upper face has a circular margin of a diameter having one or more of a wafer to be processed, and also is formed in a recessed curve face shape having the deepest part at the center part, and a difference between heights, namely between a contact point position with a mounted wafer margin and the deepest part is in the range of 20 to 500 μm.;COPYRIGHT: (C)2000,JPO