首页> 外国专利> Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods

Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods

机译:用于活化和/或调节固定磨料抛光垫的抛光液以及相关的系统和方法

摘要

Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods are disclosed. A method in accordance with one embodiment of the invention includes disposing a polishing liquid on a polishing surface of a microfeature workpiece polishing pad. The polishing pad can include a matrix material and a plurality of abrasive elements fixedly distributed in the matrix material. The polishing liquid can include a plurality of particles that are at least approximately chemically inert with respect to the abrasive elements. In a particular embodiment, the particles can have a polymeric, non-ceramic composition. The method can further include moving at least one of the polishing pad and the plurality of particles relative to the other to remove deposits from the polishing pad. This operation can be performed serially or simultaneously with using the polishing pad to remove material from a microfeature workpiece.
机译:公开了用于活化和/或调节固定的磨料抛光垫的抛光液,以及相关的系统和方法。根据本发明的一个实施例的方法包括将抛光液布置在微特征工件抛光垫的抛光表面上。抛光垫可包括基体材料和固定地分布在基体材料中的多个磨料元件。抛光液可以包括相对于研磨元件至少近似化学惰性的多个颗粒。在一个特定的实施方案中,颗粒可以具有聚合的非陶瓷组合物。该方法可以进一步包括相对于另一个移动抛光垫和多个颗粒中的至少一个,以从抛光垫去除沉积物。可以依次或同时使用抛光垫从微特征工件上去除材料来执行此操作。

著录项

  • 公开/公告号US2007093185A1

    专利类型

  • 公开/公告日2007-04-26

    原文格式PDF

  • 申请/专利权人 SUJIT NAIK;

    申请/专利号US20060639659

  • 发明设计人 SUJIT NAIK;

    申请日2006-12-15

  • 分类号B24B7/30;B24D11/00;

  • 国家 US

  • 入库时间 2022-08-21 21:05:26

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