STRUCTURE FOR CONNECTING WIRE-WOUND COIL FOR NONCONTACT ID DISCRIMINATING APPARATUS AND IC CHIP AND CONNECTING METHOD CONSTITUTING THE STRUCTURE

摘要

An appropriate portion of a wire-bound coil (1) formed of a copper wire is placed on an Au film (3a), i.e., an outermost layer of a connecting terminal (3) of an IC chip (2), then, an electrode (4) is permitted to abut to the portion of the wire-bound coil (1) from above the portion, and is pressed, while making the electrode (4) generate heat by making current flow in the electrode. In this case, the wire-wound coil (1) to be connected has a wire diameter of Φ70μm±3μm, and has a polyurethane insulating film (1a) on the copper core wire (1b). The dimension of the IC chip (2) is □ 1,000μm, metallization of a connecting terminal (3) is Ti-W-Au, and the thickness of an outermost layer Au film (3a) is 10μm. An electrode (4), i.e., a heating/pressurizing means, is formed of W (tungsten), and performs indirect heating. The conditions of welding by using such means are; a welding voltage of 1.8V, a current carrying time of 0.5sec. and a welding pressure of 80g.