A multilayer manufacturing method is provided to reduce fabrication costs and to simplify manufacturing processes by forming a powder pattern on a data line alone. A first layer is formed on a substrate(50). A surface treatment is performed on the first layer. A dispersing solution is formed by mixing a basic solution with powder and polymer. The dispersing solution is dropped on the first layer. A pre-pattern is formed on the resultant structure by performing a pre-heat treatment on the dropped dispersing solution. The first layer is selectively etched. A powder pattern(120) is formed on the resultant structure by vaporizing the polymer using a heat treatment on the pre-pattern. An electrical connection is formed in the powder pattern by a heat treatment.
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