CHEMICAL ETCHING SOLUTION FOR TUNGSTEN OR AN ALLOY OF TUNGSTEN-TITANIUM

摘要

It for tungsten or is that a corrosive agent of a titanium-tungsten metal alloy is arranged to the titanium-tungsten metal alloy of one lower bump metal of erosion, it will not attack and silver metal composition of alloy solder bump is covered by a kind of tin-, by using a corrosive agent, hydrogen peroxide containing 2 to 30% by weight, 0.By weight, wherein stabilizer is a phosphoric acid or monophosphate and water to 001 to 10% stabilizer, and the weight of corrosive agent makes up the rest. Contain 2 to 30% hydrogen peroxide by weight as a main oxidant for a corrosive agent of tungsten or a titanium-tungsten metal alloy, 0.001 to 10% stabilizer by weight, the gross weight of water, corrosive agent make up the rest. Corrosive agent also can containing 5 to 30% hydrogen peroxide by weight, 0.01 to 5% stabilizer by weight, and the rest part of the weight by water filling. Stabilizer is a phosphoric acid or monophosphate. Phosphoric acid or phosphate are selected from one group, it includes an ammonium dihydrogen phosphate, a diammonium hydrogen phosphate, an ammonium phosphate, a monosodium phosphate, a disodium hydrogen phosphate, a sodium phosphate, a potassium dihydrogen phosphate, a dipotassium hydrogen phosphate, a tripotassium phosphate, a pyrophosphoric acid, a sodium pyrophosphoric acid, a potassium pyrogaelol phosphate and monoammonium pyrophosphoric acid. Corrosive agent is used to corrode a lower bump metal of a flip chip. Lower bump metal contains tungsten or titanium-tungsten metal alloy. One solder bump, a metal contact layer of lower bump metal, including a kind of copper/can-cover silver metal alloy.