首页> 外国专利> SOG COATER IN SEMICONDUCTOR MANUFACTURING PROCESS AND THE SOG PROCESS USING THE SAME

SOG COATER IN SEMICONDUCTOR MANUFACTURING PROCESS AND THE SOG PROCESS USING THE SAME

机译:半导体制造过程中的SOG涂层及其使用的SOG过程

摘要

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor process, and more particularly, to a spin on glass (SOG) process of a semiconductor process. The SOG applicator according to the present invention includes a drive motor, a drive shaft connected to the drive motor, a spin cup on which a predetermined substrate is placed while receiving rotational force from the drive motor through the drive shaft, and spraying a predetermined coating liquid on the substrate. It characterized in that it comprises a coating liquid nozzle and a gas nozzle for injecting a gas to the coating liquid, according to the present invention, the gap fill defect generated at the edge of the substrate by coating the coating liquid evenly by the gas injection after the injection of the coating liquid in the SOG process It is effective in preventing and improving the reliability and yield of the semiconductor device.;Spin On Glass (SOG), Gap-fill Deffect, Gas Nozzle
机译:技术领域本发明涉及一种半导体工艺,更具体地,涉及一种半导体工艺的旋涂玻璃(SOG)工艺。根据本发明的SOG施加器包括:驱动马达;与驱动马达连接的驱动轴;旋转杯,其上放置有预定基板,同时通过驱动轴从驱动马达接收旋转力,并喷涂预定涂层。液体在基材上。其特征在于,其包括涂布液喷嘴和用于将气体注入到涂布液中的气体喷嘴,根据本发明,通过气体注入均匀地涂布涂布液而在基板的边缘处产生的间隙填充缺陷。在SOG工艺中注入涂料液后,可有效防止和提高半导体器件的可靠性和良率。;旋涂玻璃(SOG),间隙填充缺陷,气体喷嘴

著录项

  • 公开/公告号KR100721247B1

    专利类型

  • 公开/公告日2007-05-22

    原文格式PDF

  • 申请/专利权人 DONGBU ELECTRONICS CO. LTD.;

    申请/专利号KR20050132018

  • 发明设计人 CHOI SEUNG CHUL;

    申请日2005-12-28

  • 分类号H01L21/31;

  • 国家 KR

  • 入库时间 2022-08-21 20:32:07

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