Micro-nozzle plate manufacturing method for medical application, involves carrying mask from semiconductor substrate and etching semiconductor substrate from side to another side, where micro-nozzle is excavated from thermal oxides

摘要

The method involves applying a mask on a side of a semiconductor substrate, and applying another mask on the former mask and the semiconductor substrate. The semiconductor substrate is trenched by the latter mask up to a certain depth. The latter mask is carried and the semiconductor substrate is thermally oxidized by the former mask, where the thermal oxides are formed on a side. The former mask is carried from the semiconductor substrate and the semiconductor substrate is etched from the side to another side, where a micro-nozzle (420) is excavated from the thermal oxides. An independent claim is also included for a micro-nozzle plate with a semiconductor substrate.