Electronic circuit testing method, involves placing electronic circuit as test specimen in test arrangement with lateral supports, and detecting amount of deflection of test specimen based on applied force

摘要

The method involves placing an electronic circuit as a test specimen (1) in a test arrangement with lateral supports (3), where the electronic circuit is applied on a substrate. A mechanical force is applied perpendicular to distribution of conductive strips at a point on a surface of the test specimen. The amount of the deflection of the test specimen is detected based on the applied force. An independent claim is also included for an arrangement for execution of a method for testing electronic circuits found on a carrier material.