首页> 外国专利> MOTHER SUBSTRATE WITH SEAT, METHOD OF MANUFACTURING ELECTRONIC COMPONENT MOUNTING MOTHER SUBSTRATE, AND ELECTRONIC APPARATUS

MOTHER SUBSTRATE WITH SEAT, METHOD OF MANUFACTURING ELECTRONIC COMPONENT MOUNTING MOTHER SUBSTRATE, AND ELECTRONIC APPARATUS

机译:带座椅的母材,制造电子元件的方法,安装母材以及电子设备

摘要

PROBLEM TO BE SOLVED: To provide a mother substrate with a seat suppressing the generation of a crack on a mother substrate when an electronic component is mounted on the mother substrate, and also to provide: the method of manufacturing an electronic component mounting mother substrate in which the electronic component is mounted on the mother substrate with the seat; and an electronic apparatus excellent in terms of reliability manufactured by use of the same.;SOLUTION: A mother substrate with a seat comprises: the mother substrate 1 which comprises a first region 3 on the upper surface of the substrate, a second region 4 adjacent to the first region 3, and a division groove 2 provided between the regions and in which the end of one side of the division groove 2 reaches the edge of one side of the substrate and the end of the other side of the division groove 2 does not reach the edge of the other side of the substrate; and the seat 5 attached to the lower surface of the mother substrate 1 in such a manner that the edge of one side of the mother substrate 1 comes off and the edge of the other side of the mother substrate 1 comes into contact with a flat surface when the mother substrate 1 is mounted on a flat surface.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:为母基板提供一种在电子元件被安装到母基板上时抑制在母基板上产生裂纹的底座的底座,并且还提供:用于制造电子元件的安装母基板的方法。电子部件与座椅一起安装在母基板上;解决方案:具有座的母基板包括:母基板1,其在基板的上表面上包括第一区域3,与之相邻的第二区域4在第一区域3和第二区域之间设置有分隔槽2,分隔槽2设置在区域之间,分隔槽2的一侧的端部到达基板的一侧的边缘,而分隔槽2的另一侧的端部在分隔区域2中形成。没有到达基板另一侧的边缘;座5以使母基板1的一侧的边缘脱落而母基板1的另一侧的边缘与平坦面接触的方式安装于母基板1的下面。当将母基板1安装在平坦表面上时;版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP2008211017A

    专利类型

  • 公开/公告日2008-09-11

    原文格式PDF

  • 申请/专利权人 KYOCERA CORP;

    申请/专利号JP20070046853

  • 发明设计人 OKAMURA TAKUJI;MORIYAMA YOSUKE;

    申请日2007-02-27

  • 分类号H01L23/13;H05K1/02;H05K3/00;

  • 国家 JP

  • 入库时间 2022-08-21 20:25:58

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