首页> 外国专利> METHOD FOR SETTING HEAT RADIATION FORMATION AREA CAPABLE OF ARRANGING HEAT RADIATION COMPONENT IN CELL OR MACRO CONSTITUTING SEMICONDUCTOR CIRCUIT, HEAT RADIATION COMPONENT ARRANGEMENT METHOD FOR CELL OR MACRO CONSTITUTING SEMICONDUCTOR CIRCUIT, HEAT RADIATION FORMATION AREA SETTING PROGRAM, AND HEAT RADIATION COMPONENT ARRANGEMENT PROGRAM

METHOD FOR SETTING HEAT RADIATION FORMATION AREA CAPABLE OF ARRANGING HEAT RADIATION COMPONENT IN CELL OR MACRO CONSTITUTING SEMICONDUCTOR CIRCUIT, HEAT RADIATION COMPONENT ARRANGEMENT METHOD FOR CELL OR MACRO CONSTITUTING SEMICONDUCTOR CIRCUIT, HEAT RADIATION FORMATION AREA SETTING PROGRAM, AND HEAT RADIATION COMPONENT ARRANGEMENT PROGRAM

机译:设置能够在电池或宏观构成的半导体电路中排列热辐射成分的辐射形成区域的方法,用于细胞或宏观构成的半导体电路的热辐射成分排列方法,热辐射计算方法和区域设定

摘要

PROBLEM TO BE SOLVED: To provide a heat radiation component arrangement method capable of evading various unfavorable influences of heat radiation which may be affected to circuit operation, in a cell or a macro constituting a semiconductor circuit.;SOLUTION: In the heat radiation component arrangement method, a heat radiation formation area in which a heat radiation component can be arranged is set around a mounting position on a substrate in a cell or a macro selected as the cell or the macro for arranging the heat radiation component (step S105), and the heat radiation component is arranged in the heat radiation formation area through determination of a violation determination step so as not generate violation (wires are not contacted with each other and a wire is not contacted with the heat radiation component) (steps S110 to S113).;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种散热部件布置方法,该方法能够避免在构成半导体电路的单元或宏中对可能影响电路操作的散热的各种不利影响;解决方案:在散热部件布置中在该方法中,在单元或被选择为单元或宏的单元中的宏或布置宏的单元中的基板上的安装位置周围,设置可布置热分量的热形成区域(步骤S105),并且通过不合格判定步骤的确定将热辐射成分布置在热辐射形成区域中,以不产生不合格(导线彼此不接触并且导线不与热辐射成分接触)(步骤S110至S113) 。;版权所有:(C)2008,日本特许厅和INPIT

著录项

  • 公开/公告号JP2008059225A

    专利类型

  • 公开/公告日2008-03-13

    原文格式PDF

  • 申请/专利权人 FUJITSU LTD;

    申请/专利号JP20060234681

  • 发明设计人 UI NOBUYUKI;

    申请日2006-08-30

  • 分类号G06F17/50;H01L21/82;H01L21/822;H01L27/04;

  • 国家 JP

  • 入库时间 2022-08-21 20:25:14

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