首页> 外国专利> PHASE-CHANGE LAYER WITH DIFFERENT CRYSTALLINE LATTICE STRUCTURE IN ONE LAYER AND ITS MANUFACTURING METHOD, AND PHASE-CHANGE MEMORY ELEMENT WITH TITANIUM-DIFFUSION PREVENTING MEANS AND ITS MANUFACTURING METHOD

PHASE-CHANGE LAYER WITH DIFFERENT CRYSTALLINE LATTICE STRUCTURE IN ONE LAYER AND ITS MANUFACTURING METHOD, AND PHASE-CHANGE MEMORY ELEMENT WITH TITANIUM-DIFFUSION PREVENTING MEANS AND ITS MANUFACTURING METHOD

机译:一层具有不同晶格结构的相变层及其制造方法,以及具有钛扩散防止装置的相变存储器元件及其制造方法

摘要

PROBLEM TO BE SOLVED: To provide a phase-change layer with different crystalline lattice structure in one layer and its manufacturing method, and a phase-change memory element with Ti-diffusion preventing means and its manufacturing method.;SOLUTION: The phase-change memory element has a switching element and a storage node connected thereto. The storage node S is equipped with sequentially stacked lower laminates 30, 30a; the phase-change layer 34; and upper laminates 36, 38. The phase-change layer 34 is formed of a single layer separated to an upper layer 34b and a lower layer 34a, and the crystalline lattice structure in the upper layer 34b is different from that in the lower layer 34a. The lower layer 34a is made of a doped chalcogenide layer, the upper layer 34b is an undoped chalcogenide layer, and the upper laminate has a sequentially stacked deposition layer 36 and an upper electrode 38.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:在一层中提供具有不同晶格结构的相变层及其制造方法,以及具有防止Ti扩散的装置的相变存储元件及其制造方法。存储元件具有开关元件和与其连接的存储节点。存储节点S具备依次层叠的下部层叠体30、30a。相变层34;相变层34由分离为上层34b和下层34a的单层形成,并且上层34b中的晶格结构与下层34a中的晶格结构不同。 。下层34a由掺杂的硫属化物层制成,上层34b是未掺杂的硫属化物层,并且上层合物具有顺序堆叠的沉积层36和上电极38 。;版权所有:(C)2008,JPO&INPIT

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