The constituent for electroless deposition pattern formation, being electroless deposition pattern and the optical hardenability

摘要

PROBLEM TO BE SOLVED: To provide a composition for forming an electroless plating pattern with which a high precision electroless plating pattern of a printed circuit board can inexpensively and securely be formed in a short time and the obtained electroless plating pattern exhibits excellent adhesion to the board and insulation properties between circuits or the like, and to provide a method of forming a conductor pattern using the composition.;SOLUTION: The composition for forming an electroless plating pattern comprises: (A) a (meth)acrylate compound; (B) a chelating agent; and (C) a radical photopolymerization initiator. The technique of forming a conductor pattern uses the composition.;COPYRIGHT: (C)2005,JPO&NCIPI