Application null of the metal nano grain activated liquid in electroless deposition

摘要

PROBLEM TO BE SOLVED: To provide a method of activating a nonconductive substrate, and performing electroless plating reaction.;SOLUTION: An aqueous solution containing nanoparticles of noble metal elements and the alloy thereof is used as an activating solution in an electroless plating process, and the electroless plating reaction is carried out on the surface of a nonconductive substrate and in the pores of mμ order thereof to deposit an electrically conductive metallic layer. Thus, a copper aqueous solution for electroless plating or a nickel aqueous solution for electroless plating can satisfactorily be deposited on the surface of the nonconductive substrate and in the pores of mμ order thereof, as an electrically conductive copper metallic layer or nickel metallic layer.;COPYRIGHT: (C)2003,JPO