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Method and apparatus for a microactuator bonding pad structure for solder ball placement and reflow joint
Method and apparatus for a microactuator bonding pad structure for solder ball placement and reflow joint
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机译:用于微球致动器焊垫结构的方法和设备,用于焊球放置和回流焊
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摘要
An apparatus and method for a microactuator having a bonding pad having a solder ball retainer to decrease instances of solder ball movement. The method provides a substrate for the microactuator. A conductive layer above the substrate is provided. A bonding pad having a solder ball retainer is provided and disposed above the conductive layer. The bonding pad having a solder ball retainer provides reduced instances of movement of a solder ball disposed therewithin prior to and during a reflow process performed on the solder ball.
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