首页> 外国专利> Cyanide-free pre-treating solution for electroplating copper coating layer on magnesium alloy surface and a pre-treating method thereof

Cyanide-free pre-treating solution for electroplating copper coating layer on magnesium alloy surface and a pre-treating method thereof

机译:用于在镁合金表面电镀铜涂层的无氰化物预处理溶液及其预处理方法

摘要

A pre-treating solution for electroplating magnesium alloy surface contains copper ions, a complexing agent and an additive, wherein the complexing agent is selected from potassium sodium tartrate, potassium tartrate, sodium tartrate, tartaric acid, and dissolvable salts derivative from tartaric acid and the additive is selected from sodium phosphate, sodium hypophosphite, phosphoric acid and dissolvable salts derivative from phosphoric acid or hypophosphite acid. The magnesium alloy is dipped in the pre-treating solution and electroplated with a copper coating layer. Then, the magnesium alloy is further dipped in a copper sulfate solution for thickening the copper coating layer and lastly coated with an anti-corrosion metal layer. Thereby, magnesium alloy has excellent anti-corrosion and anti-wearing efficiency and varnish appearance. Moreover, the pre-treating solution contains no cyanide and thus is low toxic and safe to operator during electroplating and to environment after discharging.
机译:用于电镀镁合金表面的预处理溶液包含铜离子,络合剂和添加剂,其中该络合剂选自酒石酸钾钠,酒石酸钾,酒石酸钠,酒石酸和可溶于酒石酸的盐衍生物。添加剂选自磷酸钠,次磷酸钠,磷酸和磷酸或次磷酸的可溶盐衍生物。将镁合金浸入预处理溶液中并电镀铜涂层。然后,将镁合金进一步浸入硫酸铜溶液中以增厚铜涂层,最后涂覆抗腐蚀金属层。因此,镁合金具有优异的抗腐蚀和抗磨效率以及清漆外观。此外,该预处理溶液不含氰化物,因此毒性低,对电镀过程中的操作者和放电后的环境安全。

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