VARNISH FOR LAMINATE OR PREPREG, LAMINATE OR PREPREG OBTAINED WITH THIS VARNISH, AND PRINTED CIRCUIT BOARD MADE WITH THIS LAMINATE OR PREPREG

摘要

The present invention is mixed so that the (a) epoxy resin, (b) dicyandiamide, and (c) an imidazole compound having a jolhwan, (c) the (a) O.OO1 to 0.03% by weight of the ingredient content of the component by reacting with more than 70 ℃ less than 140 ℃ temperature in an organic solvent both components a heat conducting heat treatment to commercially available under the solvent-free process water and (d) the varnish for laminate or prepreg comprising the inorganic filler, obtained from these It relates to an electric insulating flame-retardant laminate or a prepreg and a printed wiring board for.; Laminate, a prepreg, a varnish, a printed wiring board