ELECTRONIC CHIP EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

An electronic chip embedded printed circuit board and a manufacturing method thereof are provided to improve heat discharging efficiency of the embedded board by stacking a metal layer on a surface of an electronic chip and connecting a via for discharging heat to the metal layer. A manufacturing method of an electronic chip embedded printed circuit board includes the steps of: punching a cavity on a core substrate and closing a surface of the cavity(P10); embedding an electronic chip stacked with a metal layer on a surface in the cavity(P20); stacking an insulating layer on the core substrate(P30); and forming a via passing through the insulating layer and contacting with the metal layer(P40). The core substrate is a CCL(Copper Clad Laminate) stacked with a copper clad layer on a surface thereof. The method further includes a step of forming an inner layer circuit by selectively removing the copper clad layer before the step of P10.