A socket board contact method is provided to maximize conductivity and to remove contact failure by applying an Au-plated electrode pad to the burn-in board and an electrode having elasticity to the other element. A contact pad(20) of a burn-in board connected to a circuit on a PCB(Printing Circuit Board)(10) is embossed by etching and formed to a fixed plane shape pad. The surface of the contact pad is Au-plated. A contact pad(30) of the other element(40) is symmetrically located on the contact pad of the burn-in board and connected. The contact pad of the other element is Au-plated, and the center is convex shaped. The contact pad of the burn-in board and the center of the contact pad of the other element have one shape of the circle, ellipse, or polygon on the plane. The one side of the contact pad of the element is fixed to the element. The other side is spaced to the element, has elasticity and is moved up and down.
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