首页> 外国专利> Coated article for printed circuit board used for assembly of electrical components, has electrically non-conducting base layer, copper and/or copper alloy layer, and layer containing electrically conductive polymer

Coated article for printed circuit board used for assembly of electrical components, has electrically non-conducting base layer, copper and/or copper alloy layer, and layer containing electrically conductive polymer

机译:用于电气元件组装的印刷电路板的涂层制品,具有不导电的基础层,铜和/或铜合金层以及包含导电聚合物的层

摘要

The coated article has an electrically non-conducting base layer (i), a copper and/or copper alloy layer (ii), and a layer (iii) containing electrically conductive polymer. The layer (iii) contains precious metal or semiprecious metal. The coated article has an electrically non-conducting base layer (i), a copper and/or copper alloy layer (ii), and a layer (iii) containing electrically conductive polymer. The layer (iii) contains precious metal or semiprecious metal. The precious metal is chosen from silver, gold, palladium, platinum, rhodium, iridium, ruthenium, osmium, and rhenium, preferably silver and gold, and more preferably silver. The semiprecious metal is nickel, titanium, copper, tin, bismuth, preferably nickel, and titanium. The layer (iii) further contains electrically non-conducting component, and complexing agent. The electrically non-conducting component is a polymer. The complexing agent is copper complexing agent, and benzimidazole, imidazole, benzotriazole, urea, thiourea, imidazole-2-thione, (sodium)ethylenediamine tetraacetate (EDTA), potassium tartrate, sodium tartrate, and/or ethylenediamine-disuccinic acid. The electrically conducting polymer is chosen from polyaniline (PAni), polythiophene (PTh), polypyrrole (PPy), poly(3,4-ethylenedioxythiophene) (PEDT), polythieno-thiophene (PTT), and their derivatives. The base layer (i) contains epoxide, epoxide composite, teflon, cyanate ester, ceramic, cellulose, cellulose composite, cardboard and/or polyimide. The coated article further has metal or alloy layer (iv) arranged between layer (ii) and layer (iii). The layer (iv) contains silver, tin, gold, palladium or platinum. A dispersion agent used for printed circuit board is chosen from electrically non-conductive component, complexing agent, viscosity modifier, flow aids, drying aids, gloss improvers, and flatting agent. An independent claim is included for manufacture of the coated article.
机译:该涂覆的制品具有不导电的基础层(i),铜和/或铜合金层(ii)以及包含导电聚合物的层(iii)。层(iii)包含贵金属或半贵金属。该涂覆的制品具有不导电的基础层(i),铜和/或铜合金层(ii)以及包含导电聚合物的层(iii)。层(iii)包含贵金属或半贵金属。贵金属选自银,金,钯,铂,铑,铱,钌,和rh,优选银和金,更优选银。半贵金属是镍,钛,铜,锡,铋,优选镍和钛。层(iii)还包含非导电组分和络合剂。不导电组分是聚合物。络合剂是铜络合剂,以及苯并咪唑,咪唑,苯并三唑,脲,硫脲,咪唑-2-硫酮,(钠)乙二胺四乙酸酯(EDTA),酒石酸钾,酒石酸钠和/或乙二胺二琥珀酸。导电聚合物选自聚苯胺(PAni),聚噻吩(PTh),聚吡咯(PPy),聚(3,4-乙撑二氧噻吩)(PEDT),聚噻吩并噻吩(PTT)及其衍生物。基础层(i)包含环氧化物,环氧化物复合物,聚四氟乙烯,氰酸酯,陶瓷,纤维素,纤维素复合物,纸板和/或聚酰亚胺。涂覆的制品还具有布置在层(ii)和层(iii)之间的金属或合金层(iv)。层(iv)包含银,锡,金,钯或铂。用于印刷电路板的分散剂选自非导电组分,络合剂,粘度调节剂,助流剂,干燥助剂,光泽改进剂和平坦剂。包括独立权利要求用于制造涂层制品。

著录项

  • 公开/公告号DE102006043811A1

    专利类型

  • 公开/公告日2008-03-27

    原文格式PDF

  • 申请/专利权人 ORMECON GMBH;

    申请/专利号DE20061043811

  • 发明设计人 WESLING BERNHARD;

    申请日2006-09-13

  • 分类号H05K3/22;H05K1/09;H01B1/12;H05K3/28;

  • 国家 DE

  • 入库时间 2022-08-21 19:49:44

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