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Coated article for printed circuit board used for assembly of electrical components, has electrically non-conducting base layer, copper and/or copper alloy layer, and layer containing electrically conductive polymer
Coated article for printed circuit board used for assembly of electrical components, has electrically non-conducting base layer, copper and/or copper alloy layer, and layer containing electrically conductive polymer
The coated article has an electrically non-conducting base layer (i), a copper and/or copper alloy layer (ii), and a layer (iii) containing electrically conductive polymer. The layer (iii) contains precious metal or semiprecious metal. The coated article has an electrically non-conducting base layer (i), a copper and/or copper alloy layer (ii), and a layer (iii) containing electrically conductive polymer. The layer (iii) contains precious metal or semiprecious metal. The precious metal is chosen from silver, gold, palladium, platinum, rhodium, iridium, ruthenium, osmium, and rhenium, preferably silver and gold, and more preferably silver. The semiprecious metal is nickel, titanium, copper, tin, bismuth, preferably nickel, and titanium. The layer (iii) further contains electrically non-conducting component, and complexing agent. The electrically non-conducting component is a polymer. The complexing agent is copper complexing agent, and benzimidazole, imidazole, benzotriazole, urea, thiourea, imidazole-2-thione, (sodium)ethylenediamine tetraacetate (EDTA), potassium tartrate, sodium tartrate, and/or ethylenediamine-disuccinic acid. The electrically conducting polymer is chosen from polyaniline (PAni), polythiophene (PTh), polypyrrole (PPy), poly(3,4-ethylenedioxythiophene) (PEDT), polythieno-thiophene (PTT), and their derivatives. The base layer (i) contains epoxide, epoxide composite, teflon, cyanate ester, ceramic, cellulose, cellulose composite, cardboard and/or polyimide. The coated article further has metal or alloy layer (iv) arranged between layer (ii) and layer (iii). The layer (iv) contains silver, tin, gold, palladium or platinum. A dispersion agent used for printed circuit board is chosen from electrically non-conductive component, complexing agent, viscosity modifier, flow aids, drying aids, gloss improvers, and flatting agent. An independent claim is included for manufacture of the coated article.
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