首页> 外国专利> Doping zone producing method for semiconductor body, involves executing short-time heat treatment at one temperature, and executing longer heat treatment at another temperature for forming doping zone

Doping zone producing method for semiconductor body, involves executing short-time heat treatment at one temperature, and executing longer heat treatment at another temperature for forming doping zone

机译:半导体本体的掺杂区的制造方法,涉及在一个温度下进行短时间的热处理,在另一个温度下进行更长的热处理以形成掺杂区的方法。

摘要

The method involves providing a semiconductor body (1). A dopant (2) is introduced into the semiconductor body, where the dopant is sulphur, selenium, Indium or antimony. A short-time heat treatment is executed at a temperature. Another heat treatment which is longer that the former heat treatment is executed at another temperature for forming a doping zone, where the former temperature is higher than the latter temperature. The former heat treatment is executed in such a manner that no diffusion of the dopant takes place in the semiconductor body.
机译:该方法涉及提供半导体本体(1)。将掺杂剂(2)引入到半导体主体中,其中掺杂剂是硫,硒,铟或锑。在一定温度下进行短时热处理。另一热处理的时间长于前者的热处理,以在另一温度下形成掺杂区,其中前者的温度高于后者的温度。以不使掺杂剂在半导体主体中扩散的方式进行前一热处理。

著录项

  • 公开/公告号DE102007017788A1

    专利类型

  • 公开/公告日2008-10-30

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE20071017788

  • 发明设计人 GUTT THOMAS;MAUDER ANTON;SCHULZE HOLGER;

    申请日2007-04-16

  • 分类号H01L21/22;H01L21/265;

  • 国家 DE

  • 入库时间 2022-08-21 19:49:15

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