INTERPENETRATING POLYMERIC NETWORK STRUCTURE, AND METHOD OF PRODUCING POLISHING PAD AND INTERPENETRATING POLYMERIC NETWORK STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an interpenetrating polymeric network structure having a surface where solute components and suspended matter are difficult to adhere and deposit on, to provide a polishing pad with high quality and excellent productivity due to causing little defects such as particle adhesion and scratches in polishing processing of semiconductor substrates and due to high polishing rate, and to provide a method of producing the same.;SOLUTION: The interpenetrating polymeric network structure includes an ethylenically unsaturated compound polymer with hydroxyl groups.;COPYRIGHT: (C)2010,JPO&INPIT